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Printed Circuit Boards

Variety of Finishes

Hot Air Solder Levelling, Sn/ Pb reflowed, Passivated copper surfaces
Ni/ Au galvanic, Ni chemical/ immersion Au, bondable and solderable
Ni chemical/ Pd/ Au in various layups
Pd chemical/ immersion Au, Au wire bondable and solderable
Sn chemical, Carbon printing, Solder paste (reflowed), Protective resist

Variety of Material

FR2-5, CEM1,3, Aramid/Epoxid/CE, Epoxid-Material
BT-Hoch TG, Gore-Ply (Epoxid/CE), Halogenfreie Epoxid-Material
Polyimid-Glas, Polyimid Flex

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